The driving force behind the development of MCM technology is the continuing need to cost-effectively interconnect multiple die without adding substantial overheads in terms of volume, weight, or reliability over conventional single chip packages and printed circuit board technology. The latter have not kept pace with advances in IC performance and density, making it difficult to implement many next generation products in the computing, communications, automotive and defence markets. The MCM approach has emerged as a way to close the gap between the advances in IC design and the increased demand on system requirements, which lead to a widespread acceptance by the industry to take the perceived risks and higher costs as trade-offs to achieve the requirements.
As the requirements for high performance systems continually increase, even MCM technology can not cope. Hence investigations have been conducted into more advanced technologies that would allow stringent requirements to be fulfilled. As a result 3D packaging technology has evolved as a natural progression from the 2D packaging technology (MCMs), as will be discussed next in chapter 3.