- ...board
- A printed circuit board is a printed board that provides both point-to-point connections and printed components in a predetermined arrangement on a common base.
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- ...pitch
- The bonding pitch is the nominal distance between the centres of adjacent pads.
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- ...bonding
- Inner lead bonding, in TAB, refers to the connections made between the chip and the etched conductors on the tape.
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- ...efficiency
- The density of chip packaging is determined by the ratio of silicon die area to printed circuit board area.
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- ...board
- The MCM-F technology can be fabricated in a configuration that not only achieves high performance at low costs, but can conform to non-planar surfaces. When such a module is encapsulated using plastic, the technology is referred to as MCM-E/F.
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- ...module
- The interconnect capacity
is defined (when vias are small or are not placed on a uniform grid) as 
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is the wiring pitch, 
is the number of signal wiring or interconnect layers.
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- ...integration
- Wafer scale integration is a level of integrated circuit complexity in which the complete circuit is interconnected on the wafer.
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- ...
- Thin Small Outline Packages (TSOPs) are normally surface mounted on a PCB packages
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- ...HDI
- ssub: Thin Film Conductors on Face of a Cube
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- ...elements
- it: stacked silicon wafers with filled vias
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- ...BiCMOS
- An integration technology which provide bipolar devices and CMOS devices on the same substrate.
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- ...RISC
- RISC is a Reduced Instruction Set Computer.
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- ...MCM
- ASIS MCM is an MCM which uses an Active Silicon Substrate. An active substrate means that the substrate has some electronic components implemented in it.
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- ...ASICs
- Applications specific integrated circuits
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- ...
- The Jet Propulsion Laboratory URL address is `http://div34www.jpl.nasa.gov/section344/tasks/afc'
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- ...current
- The amount of current that a transistor can deliver when it is fully turned on.
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