Next: Irvine Sensors Corporation Up: 3D VLSI Packaging Technology Previous: Assessment of Analog and
As a major objective of this study was to identify capabilities in 3D VLSI technology locally, an assessment of potentially relevant research, currently being undertaken by Australian institutions, was performed. Unfortunately, it was found that Australian capabilities in this area is virtually non-existent. However, some 2D MCM infrastructure does exist that can potentially form the basis for 3D MCM stacking. On the other hand, it was found that 3D packaging capabilities are already established around the world and that they are at a mature level. As part of this study we have established links with different companies who have such technology at a mature level and who are willing to give us access to their 3D technologies.
Said F. Al-Sarawi,