next up previous contents
Next: Available Semiconductor Technologies Up: 3D VLSI Packaging Technology Previous: Raytheon - Floating Point

Technology Issues

 

This chapter will discuss some of the technological issues related to implementing systems using 3D technology. Section gif will discuss some of the semiconductor technologies that are available for integration and their suitability for 3D technology. Section gif will assess analog and digital system design approaches for signal processing, and discuss their limitations.


next up previous contents
Next: Available Semiconductor Technologies Up: 3D VLSI Packaging Technology Previous: Raytheon - Floating Point

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997