This document presents the outcome of an initial 8 month period of collaboration between DSTO-LSOD and the University of Adelaide to develop capabilities in the so-called `three dimensional very large scale integration technology' or `3D VLSI packaging technology.' The focus of this research is the application of 3D VLSI packaging technology in the field of optoelectronics in order to enhance real-time automatic target recognition (ATR). Further to this, it is anticipated that the introduction of this generic technology will have an impact on many types of systems throughout the DSTO where significant reductions in size, weight, and power consumption are required.
This initial study provides a review of the state-of-the-art in 3D VLSI packaging technology, in addition to a detailed research plan to develop a specific demonstration device based on such technology. This document shall be referred to as the ``Review'' and the accompanying document shall be referred to as the ``Plan.'' The Plan outlines the development of a demonstration device, which would represent a step towards the establishment of an infrastructure in Australia with regards to 3D VLSI technology. Evaluation of this demonstrator would enable the DSTO to decide on whether to licence the 3D technology, to continue access on an as-needs contract basis or to develop its own 3D methodology. It is anticipated that these Review and research Plan documents will feed into the long term strategic planning of the DSTO in this area and that the research Plan will be adopted as the basis for a further research program.
Before discussing
the 3D VLSI packaging technology, it may be helpful to familiarise the reader
with some of the common terminology used in packaging technology, which will
be used throughout this report. Consequently, we will discuss some of the electronic
requirements for packaging - the is the focus of the following sections in this
chapter. Chapter 
gives an overview of multichip module (MCM) technology. Chapter
provides an overview of state-of-the-art 3D packaging technology and discusses
the pros and cons of the 3D VLSI packaging technology. Chapter 4 provides
a list of actual examples using this technology. Chapter 5 provides a discussion
of technical issues related to the proposed research plan. Chapter 6 provides
a list of potential collaborators from around the world. Finally, Chapter 7
provides a general conclusion to this work and addresses the feasibility of
the 3D packaging technology in the design of a real-time automatic target recognition
system.