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Interconnection Capacity Between Packaging Levels

 

For economical reasons, it is important to reduce the connection capacity between packaging levels [20]. By analogy, if all the electronic components in an IC were assembled discretely, the cost of such an assembly would be very high compared to a single IC - in addition to other reliability and robustness factors that will arise as a result of using discrete components. For this reason, 3D technology is expected to offer low cost system solutions.


next up previous contents
Next: Vertical Interconnections in 3D Up: Advantages of 3D Packaging Previous: Interconnect Capacity

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997