The interconnect capacity (also called connectivity) is a measure of the amount of wiring available in a technology. One description of interconnect capacity is the available length of wiring interconnects per unit area of the module [15, 16].
Even though the interconnect capacity for 3D packaging depends on the interconnection technique used for packaging, it can be classified between thin film (ICs interconnect technology) and wafer scale integration interconnect capacities (see Figure , which shows the interconnect capacity of different technologies). Moreover, in 3D technology, through-vias can be used instead of wires to connect components on different planes, as shown in Figures and - this enables connection of more components without using long wires, resulting in low propagation delays and good signal integrity.
Figure: Available interconnect capacity for different technologies (cm/cm ) (Adopted from ).
Figure: A comparison between 3D and 2D structures in terms of the possible number of interconnections.