Vertical Interconnections in 3D Electronics

 

Vertical Interconnections refer to the interconnections needed to route power, ground, and signals to the layers within the 3D Module. Some of the material presented here was adopted from [11]. The following subsections will describe briefly the different types of vertical interconnections.

• Periphery Interconnection between Stacked ICs
  • Stacked Tape Carrier
  • Solder Edge Conductors
  • Thin Film Conductors on Face-of-a-Cube
  • An Interconnection Substrate Soldered to the Cube Face
  • Folded Flex Circuits
  • Wire Bonded Stacked Chips
• Area Interconnection between Stacked ICs
  • Flip-chip Bonded Stacked Chips without Spacers
  • Flip-chip Bonded Stacked Chips with Spacers
  • Microbridge Springs and Thermomigration Vias
• Periphery Interconnection between Stacked MCMs
  • Solder Edge Conductors
  • Thin Film Conductors on Face-of-a-Cube
  • A flip-chip bonded to faces of the stack
  • Blind Castellation Interconnection
• Area Interconnection between Stacked MCMs
  • Arrays of Contacts between MCMs with through hole vias