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Solder Edge Conductors

 

Solder edge conductor bonding, as its name suggests, is a process where vertical interconnections between ICs are performed by soldering along the edge of an IC stack - the I/O of each die is rerouted to a conductor deposited on the edges. There are three variants of this method as follows:


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Next: Thin Film Conductors on Up: Periphery Interconnection between Stacked Previous: Stacked Tape Carrier

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997