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An Interconnection Substrate Soldered to the Cube Face

 

A separate substrate is soldered to the face of the cube as will be explained by the following variants of the method:


next up previous contents
Next: Folded Flex Circuits Up: Periphery Interconnection between Stacked Previous: Thin Film Conductors on

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997