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Bare dice are mounted and interconnected on a flexible type of material, then folded to form a 3D stack [9] as shown in Figure 
. This method is used by General Electric, Harris and MicroModule Systems.
Figure: A schematic diagram showing how ICs are stacked and interconnected using a flex type material (adopted from [11]).
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Said F.
Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997