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The University of Sheffield has
utilised a general purpose, low cost camera operating in the visible frequency
range and an image processing system using Thomson `MCM-V' 3D-MCM packaging
technology [32, 33,
34, 35],
which uses the `Direct laser write traces on epoxy cube face' method discussed
in section .
This technology can be used in the production of a low cost, high-density micro-system
incorporating sensors, bare dice and discrete components. Their system can be
interfaced with a modem making it suitable for remote sensing, security and
surveillance applications. Their device allows the transmission of data over
a digital wireless telephone network, such as GSM (Global System for Mobile
communications). The micro-camera system utilises 9 integrated circuits, 36
dicrete components and contains:
- A gray scale camera
- An analog to digital converter
- A FIFO (First In First Out) data buffer
- Four transputers (parallel processors)
- A memory for image storage
The system specifications are:
- 312 287 pixel resolution
- 70 MIPS of computational power
- 4.67 mm overall volume (20.6 15.75 14.7 mm , w l h, respectively), which is just 17% of the volume of an advanced PCB implementation using surface mount components on both sides of the board.
The following demonstration software packages were written for the micro-camera system:
- A JPEG compression program that produces a coded serial bit-stream output, operating at 2.5 frames per second.
- Motion triggered acquisition with user definable levels of motion
- Histogram equalisation.
- Sobel edge detection, currently running at around 10 frames per second.
- Time and data stamped triggered image capture.
- Windowing the image to a selectable size (with panning).
The applications of the micro-camera are:
- Remote surveillance
- Traffic monitoring
- Video logging
- Secure surveillance
- Alarm verification
- Network management
It has been reported that the size of this micro-camera can be reduced by a further 50% with advances in flip-chip bonding technology, improved surface interconnect and reduced space between stacked layers.
Next: InterChip SystemsInc. -
Up: Examples of 3D Packaging
Previous: Irvine Sensors - 3D
Said F.
Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997