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Thomson-CSF and University of Sheffield - Micro-Camera System

 

The University of Sheffield has utilised a general purpose, low cost camera operating in the visible frequency range and an image processing system using Thomson `MCM-V' 3D-MCM packaging technology [32, 33, 34, 35], which uses the `Direct laser write traces on epoxy cube face' method discussed in section gif. This technology can be used in the production of a low cost, high-density micro-system incorporating sensors, bare dice and discrete components. Their system can be interfaced with a modem making it suitable for remote sensing, security and surveillance applications. Their device allows the transmission of data over a digital wireless telephone network, such as GSM (Global System for Mobile communications). The micro-camera system utilises 9 integrated circuits, 36 dicrete components and contains:

The system specifications are:

The following demonstration software packages were written for the micro-camera system:

The applications of the micro-camera are:

It has been reported that the size of this micro-camera can be reduced by a further 50% with advances in flip-chip bonding technology, improved surface interconnect and reduced space between stacked layers.


next up previous contents
Next: InterChip SystemsInc. - Up: Examples of 3D Packaging Previous: Irvine Sensors - 3D

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997