Thomson-CSF and University of Sheffield - Micro-Camera System

 

The University of Sheffield has utilised a general purpose, low cost camera operating in the visible frequency range and an image processing system using Thomson `MCM-V' 3D-MCM packaging technology [32, 33, 34, 35], which uses the `Direct laser write traces on epoxy cube face' method discussed in section . This technology can be used in the production of a low cost, high-density micro-system incorporating sensors, bare dice and discrete components. Their system can be interfaced with a modem making it suitable for remote sensing, security and surveillance applications. Their device allows the transmission of data over a digital wireless telephone network, such as GSM (Global System for Mobile communications). The micro-camera system utilises 9 integrated circuits, 36 dicrete components and contains:

• A gray scale camera
• An analog to digital converter
• A FIFO (First In First Out) data buffer
• Four transputers (parallel processors)
• A memory for image storage

The system specifications are:

• 312 287 pixel resolution
• 70 MIPS of computational power
• 4.67 mm overall volume (20.6 15.75 14.7 mm , w l h, respectively), which is just 17% of the volume of an advanced PCB implementation using surface mount components on both sides of the board.

The following demonstration software packages were written for the micro-camera system:

• A JPEG compression program that produces a coded serial bit-stream output, operating at 2.5 frames per second.
• Motion triggered acquisition with user definable levels of motion
• Histogram equalisation.
• Sobel edge detection, currently running at around 10 frames per second.
• Time and data stamped triggered image capture.
• Windowing the image to a selectable size (with panning).

The applications of the micro-camera are:

• Remote surveillance
• Traffic monitoring
• Video logging
• Secure surveillance
• Alarm verification
• Network management

It has been reported that the size of this micro-camera can be reduced by a further 50% with advances in flip-chip bonding technology, improved surface interconnect and reduced space between stacked layers.