Examples of 3D Packaging Technology

 

This chapter lists some of the actual devices and systems implemented using 3D packaging technology with performance aspects that have benefited from using 3D technology. Even though most of the following examples are system demonstrations, there are many examples of high density stacked memories that are not listed here.

• Texas Instrument - Aladdin Parallel Processor
• Lockheed - Kill Vehicle Architecture
• Irvine Sensors - 3D Smart Sensor
• Thomson-CSF and University of Sheffield - Micro-Camera System
• InterChip Systems, Inc. - 3 Case Studies
• Texas Instruments - 1.2 Gbit Solid State Recorder
• AT&T - 3D DSP
• Harris - 3D Memories
• AT&T Bell Lab. - COC DSP/SRAM
• Fujitsu- A `GaAs on Si' PLL
• Jet Propulsion Laboratory - Advanced Flight Computing
• Raytheon - Floating Point Parallel Processor