Mr. Leon E. Arndt
Raytheon, Missile Systems Division
Tewksbury, MA 01876
Tel: 508 858 4675
Fax: 508 858 5699
Raytheon has developed a 3D MCM packaging technology using MCM-D/C with low temperature cofired ceramic, as defined in section 
. As much of Raytheon's core business is focused on intelligence, reconnaissance and surveillance, many of their programs such as the development and upgrading of sensors, platforms, ground processing and integration of complex systems, are classified. It has been reported that Raytheon has designed and is fabricating a next generation signal processor in a fully 3D stackable configuration (see subsection ).