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University of California, San Diego

 

Dr. Sing H. Lee
ECE, UCSD
Tel: 619 534 2413
Fax: 619 534 1225

We contacted Dr. Paul Franzon, of North Carolina State University, in relation to 3D VLSI technology and one of his recommendations was to contact Dr. Sing H. Lee at UCSD. This group is active in the areas of optoelectronic packaging technology, 3D stacked MCMs and fabrication and testing of smart spatial light modulators. They have developed the `flip-chip bonded stacked chips with spacers' bonding technique discussed in section gif, which was used in the design of a smart spatial light modulator.


next up previous contents
Next: Conclusion Up: Potential Collaborators Previous: Raytheon

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997