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Flip-chip Bonded Stacked Chips with Spacers

 

This is similar to the previous approach except that spacers are used to control the distance between the stacked chips. This technique was developed and used by University of Colorado and University of California, San Diego to fix a glass that contains a ferroelectric liquid crystal on the top of the VLSI chip [25, 26] as shown in Figure gif.

   figure566
Figure: A schematic diagram of two chips stacked using flip-chip technology.


next up previous contents
Next: Microbridge Springs and Thermomigration Up: Area Interconnection between Stacked Previous: Flip-chip Bonded Stacked Chips

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997