Size and Weight

 

The shift from conventional single chip packages to 3D technology, leads to substantial size and weight reductions. The main limiting factors for 3D technology are (i) the interconnection capacity (see subsection ), (ii) the thermal characteristics, and (iii) the required robustness. It has been reported that a 40-50 times reduction in size and weight is achievable using 3D technology compared to conventional packaging. As an example, volume and weight comparisons between Texas Instrument's 3D bare dice packaging, discrete and planar packaging (MCM) are presented in Tables  and . It is evident from Table  that a 5-6 times reduction in volume, over MCM technology, and a 10-20 times volume reduction, over discrete packaging technology, is possible. Moreover, a 2-13 times reduction in weight, compared to MCM technology, and a 3-19 times weight reduction, compared to discrete components, is also achievable. All of these reductions result from eliminating the overhead weight and size associated with conventional technologies.

 

 

Type Capacity Discrete Planar 3D Discrete/3D Planar/3D

SRAM 1 Mbit 1678 783 133 12.6 5.9

4 Mbit 872 249 41 21.3 6.1

DRAM 1 Mbit 1357 441 88 15.4 5.0

4 Mbit 608 179 31 19.6 5.0

16 Mbit 185 69 69 16.8 6.2

 

 

Type Capacity Discrete Planar 3D Discrete/3D Planar/3D

SRAM 1 Mbit 3538 2540 195 18.1 13.0

4 Mbit 1588 862 145 10.9 5.9

DRAM 1 Mbit 2313 1542 132 17.5 11.6

4 Mbit 862 590 113 7.6 5.2

16 Mbit 363 227 113 3.2 2.0