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Area Interconnection between Stacked ICs

 

An area interconnection is a method where vertical interconnections are not bonded to the periphery of the stacked elements, as illustrated by the following variants of this method:


next up previous contents
Next: Flip-chip Bonded Stacked Chips Up: Vertical Interconnections in 3D Previous: Wire Bonded Stacked Chips

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997