Microbridge Springs and Thermomigration Vias

  This method involves the use of microsprings to achieve the vertical interconnections between stacked ICs, as shown in Figure . Microsprings were developed and used by Hughes in the design of 3D parallel computers for real time data and image processing and avionics for F-14, F-15, F/A-18, AV-8B, B-2 aircrafts. The same technique can be used for MCMs and is also relevant to the methods presented in section .

  
Figure: A schematic diagram of Hughes microspring vertical interconnect method.