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Before MCMs are stacked, their interconnection leads are brought to the side to a metallic pad. Then an IC is bonded to these metallic pads using flipchip technology as shown in Figure 
. This approach was used by Grumman Aerospace corporation to develop surveillance technology for military applications.
Figure: A vertical interconnection method where a chip is flip bonded to the side of the stacked MCMs.
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Said F.
Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997