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Blind Castellation Interconnection

 

In this approach a semicircular or crown-shaped metallised surface (Castellation) is used for making vertical interconnections between the stacked MCMs as shown in Figure gif. This method was used by Harris and CTS Microelectronics in the design of high density memory modules.

   figure634
Figure: (a) A schematic diagram of an MCM with the blind castellation method. (b) A schematic diagram of three MCMs stacked using the blind castellation method.

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Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997