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This is a method where vertical interconnections between stacked MCMs are realised on the stack's periphery. There are three main variants of this method as follows:
Next: Solder Edge Conductors
Up: Vertical Interconnections in 3D
Previous: Microbridge Springs and Thermomigration
Said F.
Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997