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Limitations of 3D Packaging Technology

 

The 3D technology offers advantages for all types of electronic assemblies, including those for computer, military, automotive and telecommunication applications. However, there are trade-offs which need to be taken into account when using 3D technology in system design. These trade-offs are discussed in the following subsections.




next up previous contents
Next: Thermal Management Up: 3D VLSI packaging Technology Previous: Arrays of Contacts between

Said F. Al-Sarawi,
Centre for High Performance Integrated Technologies and Systems (CHIPTEC),
Adelaide, SA 5005,
March 1997