Harris company has developed a high density 3D module [38, 39, 40], shown in Figure 
, using their `Blind Castellation Interconnection' vertical interconnection method discussed in section . The Harris 3D memory module is considered as a flexible, versatile packaging scheme designed to meet most aerospace and avionics applications in a reliable and cost effective manner. For node control and fault tolerant enhancement they have included a Xilinx X3090 Field Programmable Gate Array (FPGA). Even though their stacking technique was demonstrated using memories, it can still accommodate multiple die types and sizes by customising the LTCC carriers around the specific combinations. ASICs, processors, controllers, and other devices may also be included in their stacking concept.
Figure: Harris 3D high density memory module.